: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

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ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

Auto Chip Transfer Molding Performance Parameters: ● Mold closing pressure: 98-1764kN; ● Injection pressure: 4.9-30kN adjustable; ● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm...

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ISO9001 Semiconductor Molding Machine

Chip Injection Transfer Moulding Machine

Semiconductor Transfer Moulding Machine

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